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What is the production process of silicone keys

Release time:

2022-01-07 14:53

Source:

Dongguan Mingzhen

1. Spray laser carving
The principle of laser processing technology is to project a laser beam onto a material and use the laser to interact with the material to melt, remove, weld the material or change the surface characteristics of the object.

When the silicone key product process is spraying, there are mainly three ways to feed glue: direct glue feeding, bottom glue feeding and point glue feeding.

①. Direct glue feeding method

When the product is solid and the height is not more than 1.5mm, the inclination of the product is not less than 1.5 degrees, and the product is not allowed to be glued in other ways, the mold adopts the direct glue feeding method. The glue feeding width of direct glue feeding is generally 2.50~3.00mm, the specific glue feeding width depends on the size of the product, the glue feeding thickness is generally 0.30~0.35mm, and the straight body position of 0.35~0.50mm is required to facilitate punching, and the foot column direction on the product frame should be in the opposite direction of the product surface.

When the silicone key product is hollow and has a height of 1.8mm or less, and the inclination of the product is not less than 1.5 degrees, the mold adopts the direct glue feeding method. The glue feeding width of the direct glue feeding is generally 2.50-3.00mm, and the glue feeding thickness is generally 0.30-0.40mm. The specific glue feeding width depends on the size of the product, and the maximum straight body position is 0.30mm to facilitate punching, and in order to prevent the product from sticking to the front mold, the hollow glue position part of the product rear mold is generally not drawn, and the foot column direction on the product frame should be in the opposite direction of the product surface. Author: UG Product Design Teaching

2. Back printing
For the processing process for the back of the printed key products, its glue into only one way, is directly into the glue way.

The glue reducing wave bit should be made at the glue inlet point of the front mold, and the glue reducing depth is generally 0.5mm, which is to avoid scratching the screen plate due to the burr of the glue inlet during printing. The glue reducing wave bit can be made into arc shape and square shape. For the silicone keys printed on the back, the draft angle is generally not less than 1.5 degrees, the glue inlet width is generally 2.5~3.5mm, and the glue outlet width is generally 2~2.5mm. The glue inlet and outlet position is generally 0.~ 0.5mm straight extension to facilitate punching. The glue inlet and outlet thickness is generally 0.3~0.4mm, and the specific value is determined according to the size and height of the key product. And the direction of the foot column on the frame should be consistent with the surface direction of the key product.


3. Electroplating
Plating is the process of using the principle of electrolysis to plate a thin layer of other metals or alloys on some metal surfaces. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, reflection, corrosion resistance (copper sulfate, etc.) and improve appearance.

For silicone key products with electroplating processing technology, the glue feeding method is generally direct glue feeding method and bottom glue feeding method.

There is no difference between the characteristics of the glue feeding method of electroplated silicone key products and the glue feeding characteristics of sprayed key products. The size of the glue feeding point is generally 0.6 ~ Ф 0.8mm in Ф, the inclination of the glue feeding column is generally 6-8 degrees, the front mold of the key is provided with a mold, and the glue feeding point of the front mold surface is generally 0.3~0.5mm in depth, this is to prevent the glue injection point from being injured if the product needs to be lowered when the mold is changed in the future.

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